Our 36th Annual Electronics Packaging will be held in-person this year at GE Aerospace Research Campus in Niskayuna NY. Please check the main page for the speaker and session chair info.
Here are the confirmed speakers for our 2025 Electronics Packaging Symposium. This page will fill up with speakers and session chairs as they are confirmed.
Session Chairs and Speakers
Session 0: Keynote Speakers - (Benson Chan)
Speaker: Amanda K Petford-Long (Argonne National Laboratory)
Title:
Speaker: Mark Schultz (IBM)
Title:
Session 1: Future of Computing for HPC / AI – Sathya Raghavan & Aakrati Jain (IBM)
Speaker: Clint Schow (University of California San Diego)
Title:
Speaker: Vikas Gupta (Global Foundries)
Title:
Speaker: John Knickerbocker (IBM)
Title: Co-Packaged Optics
Session 2: Photonics Packaging – John Mazurowski (Penn State Optical Lab), Colin McDonough (AIM)
Speaker: Peter O'Brien (Tyndall National Institute)
Title: Photonic and Electronic Co-Packaging Technologies – from Research to Pilot-Scale Manufacturing
Speaker: Koushik Ramachandran (Global Foundries)
Title:
Speaker:
Title:
Session 3: Thermal Challenges – Ramchandra Kotecha (GE Aerospace)
Speaker: Srikanth Rangarajan (91ÖÆƬ³§Pro)
Title: AI for energy efficient electronic systems
Speaker: Theodorian Borca-Tasciuc (Rensselaer Polytechnic Institute)
Title:
Speaker: Emad Andarawis (GE Aerospace Research)
Title:
Session 4: Flexible, Wearable and Additive Electronics – Felippe Pavinatto (GE Aerospace). Mark Poliks (91ÖÆƬ³§Pro)
Speaker: Denis Cornier (Rochester Institute of Technology, AMPrint Center)
Title:
Speaker: Christine Kallmayer (Fraunhofer IZM)
Title:
Speaker: Ben Leever (Air Force Research Laboratory)
Title:
Session 5: Heterogeneous Integration – Sathya Raghavan & Aakrati Jain (IBM)
Speaker: Manuela Junghähnel (Fraunhofer IZM)
Title:
Speaker:
Title:
Speaker:
Title:
Session 6: Substrates, Platform for Advanced Packaging – Shelby Nelson (Mosaic), Sean Garner (Corning)
Speaker: Erik Jung (Fraunhofer IZM)
Title:
Speaker: Robert Schaut (Corning)
Title:
Speaker:
Title:
Session 7: mmWave and 5G Packaging – Jason Case (GE Aerospace)
Speaker: Yong-Kyu Yoo (University of Florida)
Title:
Speaker:
Title:
Speaker:
Title:
Session 8: Power Electronics / Harsh Environments – David Shaddock (GE), Xaioling Li (NREL)
Speaker: Doug Hopkins (North Carolina State)
Title:
Speaker: Alan Mantooth (University of Arkansas)
Title:
Speaker:
Title: